Smiths Interconnect is using system simulation models to create custom heat removal lids for ICs under test. “Traditional solutions including finned and liquid cooled heatsinks […]
Read the original post by Steve Bush
Consumer Electronics in the News
Smiths Interconnect is using system simulation models to create custom heat removal lids for ICs under test. “Traditional solutions including finned and liquid cooled heatsinks […]
Read the original post by Steve Bush