Infineon is claiming a first, with an industrial-grade embedded SIM (eSIM) in a 2.5 x 2.7mm wafer-level chip-scale package (WLCSP). It is aimed at machine-to-machine […]
Read the original post by Steve Bush
Consumer Electronics in the News
Infineon is claiming a first, with an industrial-grade embedded SIM (eSIM) in a 2.5 x 2.7mm wafer-level chip-scale package (WLCSP). It is aimed at machine-to-machine […]
Read the original post by Steve Bush